Measure the feature.
Verify the performance.
Dimensional metrology, product testing
and electronics inspection.
Coordinate & optical measurement
Dimensional inspection for molded components, with measurement requirements defined against the part drawing. Dimensional testing ↗
- Hexagon Global Advantage CMM
- Coordinate measurement of part geometry and specified dimensions. CMM facility ↗
- SmartScope
- Optical dimensional inspection, complementing CMM measurement.
- Drawing-led inspection
- Agree the critical features, datums, measurement method and acceptance limits before inspection.
Explore our testing scope
Select a category for test methods and application-specific requirements.
Polymer material testingTensile strength · impact resistance · hardness+
Evaluate material properties against the requirements of the component. Define the resin grade, specimen preparation and applicable test method with the project team. Material test scope ↗
Product reliabilityDrop · vibration · environmental test scope+
Assess performance under the mechanical and environmental conditions specified for the application. Product test scope ↗
- Drop testing
- Vibration testing
Environmental testing for harnesses +
Wire-harness test programmes cover temperature cycling, humidity, salt spray and shock, with methods and facilities selected for the application. Environmental scope ↗
Application-specific test profiles, fixtures, duration and acceptance criteria.
SMT PCBA inspectionSPI · AOI · X-ray · ICT+
Complementary inspection and electrical-test methods across the SMT PCBA process.
- SPISolder paste inspection
- Inspect paste deposits before component placement.
- AOIAutomated optical inspection
- Inspect component presence, placement and visible solder defects.
- X-rayHidden-joint inspection
- Examine concealed solder joints and internal solder features.
- ICTIn-circuit testing
- Electrical checks for opens, shorts and component values within the test coverage.
Electronics inspection Inspection-method reference ↗. Dedicated inspection methods for SMT PCBA production.
Wire-harness testingContinuity · insulation resistance · short circuits+
Electrical checks for harness continuity and insulation integrity. Agree pin-to-pin connections, insulation limits and the electrical test specification. Harness test scope ↗
Mechanical and environmental requirements are covered under product reliability.
Have a drawing, test specification or inspection requirement?
Define what must be demonstrated.
| Testing category | Project-specific definition |
|---|---|
| Dimensional inspection | Identify drawing revision, datums, critical features, tolerance and sampling plan. CMM and optical inspection are selected according to the feature and measurement task. |
| Polymer material tests | Tensile, impact and hardness testing appear in the published scope. Agree material identity, specimen preparation, test method and acceptance requirements. Service details ↗ |
| Product reliability | Define the drop or vibration profile, fixture, orientation, conditioning and functional acceptance needed for the application. Service details ↗ |
| Electronics inspection | SPI, AOI, X-ray and ICT address different SMT PCBA process risks, with board revision, inspection stage, coverage and acceptance criteria defined for the programme. |
| Reporting | Request sample identification, method, equipment/provider, conditions, results and an explicit comparison to the agreed specification. |
Match the method to the facility.
Each test programme defines the method, equipment, delivery location and reporting requirements.
Specialist testing is coordinated with the laboratory provider, including PlastIQ as a separate business, with clear ownership of each deliverable.
Inspection records & quality systems ↗